Optoelectronic interconnection board, optoelectronic...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C385S088000

Reexamination Certificate

active

07623743

ABSTRACT:
An optoelectronic interconnection board on which an optical semiconductor device can be mounted, an optoelectronic interconnection apparatus using the optoelectronic interconnection board, and a manufacturing method thereof are disclosed. According to one aspect of the present invention, there is provided an optoelectronic interconnection board including optical interconnection lines having optical waveguides and electric interconnection lines formed of an electroconductive material, includes a main optical waveguide through which an optical signal is transmitted when an optical functional device is disposed on the optoelectronic interconnection board, a main optical input/output portion which transmits/receives the optical signal to/from the main optical waveguide, a monitoring optical input/output portion which is provided to align with the main optical input/output portion and transmits/receives light to/from the monitoring optical waveguide.

REFERENCES:
patent: 4892374 (1990-01-01), Ackerman et al.
patent: 5355386 (1994-10-01), Rothman et al.
patent: 5436996 (1995-07-01), Tabasky et al.
patent: 5574811 (1996-11-01), Bricheno et al.
patent: 5604832 (1997-02-01), Hall et al.
patent: 5621837 (1997-04-01), Yamada et al.
patent: 5703973 (1997-12-01), Mettler et al.
patent: 5999269 (1999-12-01), Haugsjaa et al.
patent: 6023339 (2000-02-01), Haugsjaa et al.
patent: 6027255 (2000-02-01), Joo et al.
patent: 6069991 (2000-05-01), Hibbs-Brenner et al.
patent: 6088498 (2000-07-01), Hibbs-Brenner et al.
patent: 6090635 (2000-07-01), Rothman et al.
patent: 6101210 (2000-08-01), Bestwick et al.
patent: 6181856 (2001-01-01), Brun
patent: 6374021 (2002-04-01), Nakanishi et al.
patent: 6404960 (2002-06-01), Hibbs-Brenner et al.
patent: 6453096 (2002-09-01), Kim et al.
patent: 6483969 (2002-11-01), Yap et al.
patent: 6516104 (2003-02-01), Furuyama
patent: 6640021 (2003-10-01), Pogge et al.
patent: 6690851 (2004-02-01), Guilfoyle
patent: 6709607 (2004-03-01), Hibbs-Brenner et al.
patent: 6754407 (2004-06-01), Chakravorty et al.
patent: 6773532 (2004-08-01), Wolf et al.
patent: 6804423 (2004-10-01), Tsukamoto et al.
patent: 6859470 (2005-02-01), Fu et al.
patent: 6917731 (2005-07-01), Bennett et al.
patent: 6937385 (2005-08-01), Bennett et al.
patent: 6941631 (2005-09-01), Jenner
patent: 6987906 (2006-01-01), Nakama et al.
patent: 6996305 (2006-02-01), Kim et al.
patent: 7021833 (2006-04-01), Loh et al.
patent: 7062117 (2006-06-01), Uchida
patent: 7068892 (2006-06-01), Lu et al.
patent: 7072535 (2006-07-01), Uchida
patent: 7112885 (2006-09-01), Chen et al.
patent: 7120325 (2006-10-01), Uchida
patent: 7135777 (2006-11-01), Bakir et al.
patent: 7139448 (2006-11-01), Jain et al.
patent: 7160037 (2007-01-01), Dudek et al.
patent: 7197202 (2007-03-01), Kim et al.
patent: 7197221 (2007-03-01), Ohtsu et al.
patent: 7209621 (2007-04-01), Glebov et al.
patent: 7224857 (2007-05-01), Liu
patent: 7235150 (2007-06-01), Bischel et al.
patent: 7271461 (2007-09-01), Dutta
patent: 7289701 (2007-10-01), Lam et al.
patent: 7333682 (2008-02-01), Kobayashi et al.
patent: 7334946 (2008-02-01), Lu
patent: 7346260 (2008-03-01), Arakida et al.
patent: 7366380 (2008-04-01), Peterson et al.
patent: 7382960 (2008-06-01), Ohtsu et al.
patent: 7387913 (2008-06-01), Yoshimura et al.
patent: 2002/0110328 (2002-08-01), Bischel et al.
patent: 2002/0181882 (2002-12-01), Hibbs-Brenner et al.
patent: 2003/0133668 (2003-07-01), Wagner et al.
patent: 2003/0174419 (2003-09-01), Kindler et al.
patent: 2003/0184846 (2003-10-01), Bennett et al.
patent: 2003/0185483 (2003-10-01), Bennett et al.
patent: 2003/0185485 (2003-10-01), Bennett et al.
patent: 2003/0185486 (2003-10-01), Bennett et al.
patent: 2003/0185518 (2003-10-01), Bennett et al.
patent: 2003/0223683 (2003-12-01), Bennett et al.
patent: 2004/0001717 (2004-01-01), Bennett et al.
patent: 2004/0008952 (2004-01-01), Kragl
patent: 2004/0017602 (2004-01-01), Bennett et al.
patent: 2004/0017977 (2004-01-01), Lam et al.
patent: 2004/0028323 (2004-02-01), Bennett et al.
patent: 2004/0096152 (2004-05-01), Nakama et al.
patent: 2004/0105611 (2004-06-01), Bischel et al.
patent: 2004/0151441 (2004-08-01), Bennett et al.
patent: 2004/0208416 (2004-10-01), Chakravorty et al.
patent: 2004/0212030 (2004-10-01), Asai
patent: 2004/0228584 (2004-11-01), Dudek et al.
patent: 2004/0240805 (2004-12-01), Vakhshoori et al.
patent: 2004/0247236 (2004-12-01), Yoshimura et al.
patent: 2004/0258347 (2004-12-01), Gothoskar et al.
patent: 2004/0263845 (2004-12-01), Schaller et al.
patent: 2005/0046928 (2005-03-01), Bischel et al.
patent: 2005/0111781 (2005-05-01), Jain et al.
patent: 2006/0018588 (2006-01-01), Uchida
patent: 2006/0062512 (2006-03-01), Lee et al.
patent: 2006/0067608 (2006-03-01), Kobayashi et al.
patent: 2006/0093010 (2006-05-01), Sekiya et al.
patent: 2006/0133718 (2006-06-01), Liu
patent: 2006/0171627 (2006-08-01), Aoki et al.
patent: 2006/0198569 (2006-09-01), Ohtsu et al.
patent: 2006/0215963 (2006-09-01), Hamano
patent: 2006/0245681 (2006-11-01), Uchida
patent: 2007/0013061 (2007-01-01), Chen et al.
patent: 2007/0019914 (2007-01-01), Ohtsu et al.
patent: 2007/0047886 (2007-03-01), Gorczyca
patent: 2007/0063342 (2007-03-01), Chen et al.
patent: 2007/0104416 (2007-05-01), Shimizu et al.
patent: 2007/0110373 (2007-05-01), Dudek et al.
patent: 2007/0140627 (2007-06-01), Lu
patent: 2007/0140633 (2007-06-01), Ohtsu et al.
patent: 2007/0147729 (2007-06-01), Dellmann et al.
patent: 2007/0217750 (2007-09-01), Budd et al.
patent: 2007/0223935 (2007-09-01), Asai et al.
patent: 2007/0248139 (2007-10-01), Bischel et al.
patent: 2008/0044127 (2008-02-01), Leising et al.
patent: 2008/0095499 (2008-04-01), Oda et al.
patent: 3612243 (2004-10-01), None
Yuzo Ishii, et al., “SMT-Compatible Optical-I/O Chip Packaging for Chip-Level Optical Interconnects”, Proc. IEEE Electronic Components and Technology Conference, 2001, 6 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Optoelectronic interconnection board, optoelectronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optoelectronic interconnection board, optoelectronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optoelectronic interconnection board, optoelectronic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4126800

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.