Optoelectronic integrated circuit device and communications...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Details

C385S024000, C385S083000, C385S049000, C385S088000, C385S089000, C385S129000, C385S130000, C385S131000, C385S132000

Reexamination Certificate

active

07657136

ABSTRACT:
A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board. A quadrilateral package substrate11; an LSI package13mounted on the package substrate11; photonic devices12mounted along two or more sides of the LSI package13; first photonic devices electrically connected to I/O terminals disposed on one side of the LSI package13; second photonic devices electrically connected to I/O terminals disposed on a different side of the LSI package13; first optical waveguides for connecting between the optical signal I/O terminals of the first photonic devices and an external component or device; and second optical waveguides for connecting between the optical I/O terminals of the second photonic devices and an external component or device; wherein the first and second optical waveguides are terminated on the same side edge of the package substrate11.

REFERENCES:
patent: 5008554 (1991-04-01), Asakawa et al.
patent: 5757989 (1998-05-01), Yoshimura et al.
patent: 6696755 (2004-02-01), Kami et al.
patent: 2003/0025962 (2003-02-01), Nishimura
patent: 2003/0173663 (2003-09-01), Kami et al.
patent: 2009/0003761 (2009-01-01), Matsuoka et al.
International Search Report of PCT/JP2004/014226 mailed Dec. 28, 2004.
Kazuhiko Kurata et al., “Opto-Electronics Packaging Techniques for Interconnection”, 2003 IEEE, pp. 364-365.

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