Optoelectronic device with patterned-metallized package...

Details Optoelectronic device with patterned-metallized package... Optoelectronic device with patterned-metallized package...

2007-07-24

2007-07-24

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

C257S730000, C257S787000, C257S795000

Reexamination Certificate

active

10792538

ABSTRACT:
An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

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