Optoelectronic device submount

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C438S025000, C438S026000, C438S028000

Reexamination Certificate

active

07732829

ABSTRACT:
A submount for an optoelectronic device includes a substrate, a first top pad on a top surface of the substrate, a first bottom pad on a bottom surface of the substrate and a first wrap-around contact in a sidewall recess of the substrate, in which the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad. Alternatively, or in addition, the submount includes a device mounting pad on the top surface of the substrate, a wire-bond pad on the top surface of the substrate, a contact pad on the bottom surface of the substrate and a feedthrough contact which extends through the substrate and electrically couples the wire-bond pad to the contact pad.

REFERENCES:
patent: 3982268 (1976-09-01), Anthony et al.
patent: 4843280 (1989-06-01), Lumbard et al.
patent: 6486499 (2002-11-01), Krames et al.
patent: 6642550 (2003-11-01), Whitworth et al.
patent: 7189962 (2007-03-01), Tomioka
patent: 7253388 (2007-08-01), Kuhmann et al.
patent: 2005/0051789 (2005-03-01), Negley
patent: 2006/0006404 (2006-01-01), Ibbetson et al.
patent: 2006/0054910 (2006-03-01), Takemori et al.
patent: 2007/0170450 (2007-07-01), Murphy
patent: 11-026647 (1999-01-01), None
patent: 2003-046256 (2003-02-01), None

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