Optoelectronic device, metal mold for manufacturing the device a

Details Optoelectronic device, metal mold for manufacturing the device a Optoelectronic device, metal mold for manufacturing the device a

1991-10-08

1993-09-14

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Signal isolator

257 82, G02B 2700

Patent

active

052451984

ABSTRACT:
An optoelectronic device comprising: a plurality of light emitting elements; light receiving elements, each light receiving element facing a light emitting element; a lead made of a thin metal plate and having the light receiving elements fixed thereon, the lead being connected by wires to ground electrodes provided on the light receiving elements; a plurality of ground terminals common to the light receiving elements and integrated with the lead; an inner package, made of translucid resin, for separately sealing each pair of the facing light emitting elements and light receiving elements; and a package, made of resin having light interrupting properties, for sealing the entire inner package. Also, a metal mold that can simultaneously mold a plurality of the inner packages; and a manufacturing method of the optoelectronic device using the metal mold, comprising the steps of: molding the inner package; and then molding the package. Accordingly, a miniature optoelectronic device which has a small number of terminals and in which no crosstalk occurs can be achieved and efficiently manufactured.

REFERENCES:
patent: 4058821 (1977-11-01), Miyoshi et al.
patent: 4136351 (1979-01-01), Sugawara et al.
patent: 4446375 (1984-05-01), Aird
patent: 4712017 (1987-12-01), Kamasaki
patent: 4719358 (1988-01-01), Matsumoto et al.
Informationsschrift of the Company Hewlett Packard 5952-0466 Apr. 1974 Dual Channel Hermetically Sealed Optically Coupled Isolator. U.S.A.

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