Optoelectronic device component package

Details Optoelectronic device component package Optoelectronic device component package

1990-12-12

1992-09-22

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

250239, 357 30, H01J 314, H01L 2714

Patent

active

051499584

ABSTRACT:
An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.

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