Radiant energy – Photocells; circuits and apparatus – Housings
Reexamination Certificate
2008-03-25
2008-03-25
Le, Que T (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Housings
C250S214100
Reexamination Certificate
active
07348550
ABSTRACT:
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 4104674 (1978-08-01), Lorenze et al.
patent: 4826272 (1989-05-01), Pimpinella et al.
patent: 4897711 (1990-01-01), Blonder et al.
patent: 5091991 (1992-02-01), Briggs et al.
patent: 5179609 (1993-01-01), Blonder et al.
patent: 5199093 (1993-03-01), Longhurst
patent: 5212754 (1993-05-01), Basavanhally et al.
patent: 5259054 (1993-11-01), Benzoni et al.
patent: 5420954 (1995-05-01), Swirhun et al.
patent: 5428704 (1995-06-01), Lebby et al.
patent: 5479540 (1995-12-01), Boudreau et al.
patent: 5574814 (1996-11-01), Noddings et al.
patent: 5590232 (1996-12-01), Wentworth et al.
patent: 5611013 (1997-03-01), Curzio
patent: 5696862 (1997-12-01), Hauer et al.
patent: 5719978 (1998-02-01), Kakii et al.
patent: 5912872 (1999-06-01), Feldman et al.
patent: 5917976 (1999-06-01), Yamaguchi
patent: 5985696 (1999-11-01), Brunner et al.
patent: 6056448 (2000-05-01), Sauter et al.
patent: 6103398 (2000-08-01), Norton et al.
patent: 6203212 (2001-03-01), Rosenberg et al.
patent: 2005/0205771 (2005-09-01), Sherrer et al.
patent: 2005/0218317 (2005-10-01), Sherrer et al.
patent: 2006/0006313 (2006-01-01), Sherrer et al.
patent: 2006/0006321 (2006-01-01), Sherrer et al.
patent: 0 609 062 (1994-08-01), None
patent: 0 465 230 (1995-05-01), None
patent: 0 740 852 (1999-08-01), None
patent: 2 312 551 (1997-10-01), None
patent: 01-134956 (1989-05-01), None
patent: 1997-027643 (1997-01-01), None
patent: 1997-083018 (1997-03-01), None
patent: WO 97/47040 (1997-12-01), None
S. Esener, Optical Storage Technology, JTEC Panel Report on Optoelectronics in Japan and the United States, Chapter 3, International Technology Reseach Institute, Feb. 1996, pp. 35-64.
Hashimoto et al., Multichip Optical Hybrid Integration Technique with Planar Lightwave Circuit Platform, Journal of Lightwave Technology, vol. 16, No. 7, Jul. 1998, pp 1249-1258.
L. Linder et al., “Fabrication Technology for Wafer Through Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers”; IEEE, 0-7803-1833-1/94, 1994.
Heiks Noel A.
Sherrer David W.
Baskin Jonathan D.
Le Que T
Rohm and Haas Electronic Materials LLC
LandOfFree
Optoelectronic component with front to side surface... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optoelectronic component with front to side surface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optoelectronic component with front to side surface... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2809708