Optoelectronic component and method for the production thereof

Details Optoelectronic component and method for the production thereof Optoelectronic component and method for the production thereof

2007-08-14

2007-08-14

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Encapsulated

C257SE33059, C257SE33067

Reexamination Certificate

active

10481528

ABSTRACT:
In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.

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http;//www.ise.fhg.de/Press—info/pi0100—german.html and English translation.
www.messe-stuttgart.de/ww/download
e—5.doc and English translation.

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