Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated
Reexamination Certificate
2007-08-14
2007-08-14
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
Encapsulated
C257SE33059, C257SE33067
Reexamination Certificate
active
10481528
ABSTRACT:
In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.
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F. Möllmer and G. Waitl, “Siemens SMT-Topled für die Oberflächenmontage” [“Siemens SMT-Topled for surface mounting”], Siemens Components 29 (1991), Issue 4, pp, 147-149.
http;//www.ise.fhg.de/Press—info/pi0100—german.html and English translation.
www.messe-stuttgart.de/ww/download
e—5.doc and English translation.
Braune Bert
Kromotis Patrick
Cohen Pontani Lieberman & Pavane LLP
Osram Opto Semicondutors GmbH
Zarneke David A.
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