Opto-electrical module packaging

Details Opto-electrical module packaging Opto-electrical module packaging

2006-02-28

2006-02-28

Healy, Brian (Department: 2883)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S031000, C385S052000

Reexamination Certificate

active

07004642

ABSTRACT:
The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.

REFERENCES:
patent: 5123066 (1992-06-01), Acarlar
patent: 5506445 (1996-04-01), Rosenberg
patent: 6031856 (2000-02-01), Wu et al.
patent: 6377742 (2002-04-01), Go
patent: 6726375 (2004-04-01), Kato et al.
patent: 2003/0138989 (2003-07-01), Duesman et al.
patent: 2005/0036732 (2005-02-01), Kropp

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