Optimum surface contour for conductive heat transfer with a thin

Details Optimum surface contour for conductive heat transfer with a thin Optimum surface contour for conductive heat transfer with a thin

1982-05-25

1984-07-10

Richter, Sheldon J.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

51324, 118724, 118728, 165 80C, F28F 900

Patent

active

044587465

ABSTRACT:
For enhanced heat conductive transfer from a semiconductor wafer during ion implantation, the wafer is clamped to a platen having a contour f(r,.theta.) computed to establish uniform contact pressure over said wafer for a number, n, of discrete clamping locii distributed along the periphery of the wafer. The available area of the wafer is thus maximized.

REFERENCES:
patent: 3920233 (1975-11-01), Stuckert
patent: 4282924 (1981-08-01), Faretra
Ultra-High Vacuum Evaporation/Sputtering Apparatus for Cryogenic Thin Film Technology, Carbone et al., IBM Tech. Disc. Bull., vol. 22, No. 2, Jul. 1979, pp. 550-554.

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