Optimum condition detection method for flip-chip

Details Optimum condition detection method for flip-chip Optimum condition detection method for flip-chip

1999-08-26

2000-08-01

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

436107, 436108, 436455, H01L 2144, H01L 2148, H01L 2150

Patent

active

060965754

ABSTRACT:
An optimum condition detection method for flip-chip bonding that facilitates simple detection of optimum pressure and heating temperature for flip-chip bonding implemented by use of bonding material is provided.
Pressure applied to a semiconductor chip is increased at a first predetermined rate so that the semiconductor chip is pressed against a substrate until contact pressure applied through an anisotropic conductive film or the like between a bump of the semiconductor chip and a pad of the substrate reaches below a first setup value; the heating temperature for the semiconductor chip is increased at a second predetermined rate until the temperature of the semiconductor chip reaches above a setup temperature; when the contact resistance reaches below the first setup value and the temperature of the semiconductor chip reaches above the setup temperature, the pressure applied to the semiconductor chip and the heating temperature for the semiconductor chip are kept constant, under which condition after a predetermined period of time has elapsed, the pressure applied to the semiconductor chip and heating temperature for the semiconductor chip are decreased, respectively.

REFERENCES:
patent: 5763288 (1998-06-01), Sakaguchi et al.
patent: 5928458 (1999-07-01), Aschenbrenner et al.

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