Optimizing the thermal budget during a pulsed heating process

Details Optimizing the thermal budget during a pulsed heating process Optimizing the thermal budget during a pulsed heating process

2006-05-30

2010-06-29

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C118S725000, C118S050100, C118S728000, C118S729000, C118S730000

Reexamination Certificate

active

07745762

ABSTRACT:
An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enhance the thermal transfer rate from the object so that the object is rapidly brought down from the peak temperature after an energy pulse. High thermally-conductive material may be positioned between the plate and the object. The plate may include protrusions, ribs, holes, recesses, and other discontinuities to enhance heat transfer and avoid physical damage to the object during the thermal cycle. Additionally, the optical properties of the plate may be selected to allow for temperature measurements via energy measurements from the plate, or to provide for a different thermal response to the energy pulse. The plate may also allow for pre-heating or active cooling of the wafer.

REFERENCES:
patent: 4350537 (1982-09-01), Young et al.
patent: 4356384 (1982-10-01), Gat
patent: 4415794 (1983-11-01), Delfino et al.
patent: 4649261 (1987-03-01), Sheets
patent: 4698486 (1987-10-01), Sheets
patent: 5119760 (1992-06-01), McMillan et al.
patent: 5160575 (1992-11-01), Chen
patent: 5308594 (1994-05-01), Chen
patent: 5561735 (1996-10-01), Camm
patent: 5645646 (1997-07-01), Beinglass et al.
patent: 5705224 (1998-01-01), Murota et al.
patent: 6383902 (2002-05-01), Niemann et al.
patent: 6594446 (2003-07-01), Camm et al.
patent: 6849831 (2005-02-01), Timans et al.
patent: 6859616 (2005-02-01), Kususa et al.
patent: 6919271 (2005-07-01), Gat
patent: 7037797 (2006-05-01), Shooshtarian et al.
patent: 7045746 (2006-05-01), Devine et al.
patent: 7501607 (2009-03-01), Camm et al.
patent: 2002/0195437 (2002-12-01), Kusuda
patent: 2003/0081945 (2003-05-01), Kusuda
patent: 2004/0105670 (2004-06-01), Kusuda et al.
patent: 2004/0178553 (2004-09-01), Camm et al.
patent: 2005/0023267 (2005-02-01), Timans et al.
patent: 2005/0047767 (2005-03-01), Nozaki
PCT International Search Report for International Application No. PCT/US06/20813 dated Jun. 10, 2008.
N. Acharya & P.J. Timans, “Fundamental Issues in Millisecond Annealing” (Electrochemical Society, Pennington, 2004), p. 11.
J. R. Logan, P. S. Dobson, C. Hill and P. J. Pearson, “Recrystallisation of Amorphous Silicon Films by Rapid Isothermal and Transient Annealing” (Semicond. Sci. Technol.vol. 3, (1988)) p. 437.
J. Murota, M. Sakuraba and S. Ono, “Silicon Atomic Layer Growth Controlled by Flash Heating in Chemical Vapor Deposition Using SiH4Gas” (Appl. Phys. Lett.vol. 62, (1993)) p. 2353.
N. C. Tung, “Application of Rapid Isothermal Annealing to Shallow p-n Junctions via BF2Implants” (J. Electrochem. Soc.vol. 132, (1985)) p. 914.

Affiliated with

Also associated with

Rating

Optimizing the thermal budget during a pulsed heating process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optimizing the thermal budget during a pulsed heating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optimizing the thermal budget during a pulsed heating process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4249480