Optimized routing scheme for an integrated circuit/printed circu

Details Optimized routing scheme for an integrated circuit/printed circu Optimized routing scheme for an integrated circuit/printed circu

1997-06-20

1998-12-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361751, 361762, 361760, 361764, 361765, 361777, 361807, 361808, 361820, 257700, 257738, 257774, 257778, 257773, 257787, 174250, 174255, 174256, 174260, 174261, 174265, 174266, H05K 114

Patent

active

058479368

ABSTRACT:
A method and structure for routing electrically conductive interconnect paths through a printed circuit board. The printed circuit board includes a plurality of insulating layers and conductive layers, including at least one electrically conductive voltage supply layer for receiving a first supply voltage. A plurality of voltage supply pad patterns are located at the upper surface of the printed circuit board. Each voltage supply pad pattern includes two or more electrically conductive pads which are coupled by one or more electrically conductive traces. Electrically conductive via plugs extend through the printed circuit board to connect the voltage supply layer to the voltage supply pad patterns. Each via plug is connected to one corresponding voltage supply pad pattern, thereby allowing each via plug to provide the first supply voltage to a plurality of pads at the upper surface of the printed circuit board. As a result, the number of via plugs required for routing the first supply voltage through the printed circuit board is reduced, thereby increasing the layout area available for routing conductive traces in other layers of the printed circuit board.

REFERENCES:
patent: 5191174 (1993-03-01), Chang et al.
patent: 5400220 (1995-03-01), Swamy
patent: 5450283 (1995-09-01), Lin et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5598036 (1997-01-01), Jo
patent: 5615477 (1997-04-01), Sweitzer

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