Optimization multiple performance criteria by simulating the beh

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364578, G06F 1750

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057294666

ABSTRACT:
A system, method, and software product in a computer aided design apparatus for system design, to simultaneously optimize multiple performance criteria models of the system, where the performance criteria models are characterized by convex cost functions based on linear dimensional characteristics of the system being designed. One embodiment is provided in a computer aid design environment for integrated circuit design, and used to simultaneously optimize fabrication yield along with other performance criteria. Optimization is provided by converting a structural description of an integrated circuit into a constraint graph, compacting, and modifying the constraint graph to include convex cost functions for selected performance criteria to be optimized, such as yield cost functions. The cost functions are then transformed to piecewise linear cost functions. The constraint graph is directly minimized by an improved wire length minimizer that treats the piecewise linear cost function of each edge of the constraint graph as if it were a subgraph, without actually expanding the constraint graph with the subgraphs of the piecewise linear cost functions. Once minimized, the constraint graph describes the positions of circuit elements that maximize yield (and other selected performance criteria) given the cost functions.

REFERENCES:
patent: 4745084 (1988-05-01), Rowson et al.
patent: 4918614 (1990-04-01), Modarres et al.
patent: 5257201 (1993-10-01), Berman et al.
patent: 5557531 (1996-09-01), Rostoker et al.
Stapper, C.H., "Modeling of Defects in Integrated Circuit Photolithographic Patterns", IBM, J. Res. Develop., vol. 28, No. 4, pp. 461-475, Jul., 1984.
Maly, Wojciech, "Cost of Silicon Viewed from VLSI Design Perspective", 31st ACM/IEEE Design Automation Conference, pp. 135-142, 1994.
Pitaksanonkul, A., Thanawastien, S., Lursinsap, C., Ghandhi, J.A., "DTR: A Defect-Tolerant Routing Algorithm", 26th ACM/IEEE Design Automation Conference, pp. 795-799, 1989.
Strojwas, Andrezej J., "Design for Manufacturability and Yield", 26th ACM/IEEE Design Automation Conference, pp. 454-458, 1989.
Stapper, Charles H., and Rosner, Raymond J., "Integrated Circuit Yield Management and Yield Analysis: Development and Implementation", IEEE Transactions on Semiconductor Manufacturing, vol. 8, No. 2, pp. 95-102, May, 1995.
Kuo, Sy-Yen, "YOR: A Yield-Optimizing Routing Algorithm by Minimizing Critical Areas and Vias", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 12, No. 9, pp. 1303-1311, Sep., 1993.
Chiluvuri, Venkat K.R. and Koren, Israel, "Layout-Synthesis Techniques for Yield Enhancement", IEEE Transactions on Semiconductor Manufacturing, vol. 8, No. 2, pp. 178-187, May, 1995.
Huijbregts, Ed P., Xue, Hua and Jess, Jochen A.G., "Routing for Reliable Manufacturing", IEEE Transactions on Semiconductor Manufacturing, vol. 8, No. 2, pp. 188-194, May, 1995.
Xue, Hua, Huijbregts, Ed P. and Jess, Jochen A.G., "Routing for Manufacturability", 31st ACM/IEEE Design Automation Conference, pp. 402-406, 1994.

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