Optimization method of deposition time and an optimization...

Details Optimization method of deposition time and an optimization... Optimization method of deposition time and an optimization...

2007-10-09

2007-10-09

Jarrett, Ryan A (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

Reexamination Certificate

active

10785711

ABSTRACT:
An optimum method for deposition time is provided that can improve uniformity of processing time of oxidation thickness. When starting a heat oxidation process, a time for optimum oxidation processing in the process management system is calculated based on atmospheric pressure data, a target thickness of that process, oxidization time, thickness data and atmospheric pressure data in the immediately preceding process under the same oxidization processing job. The optimum system comprises a process management system such as a host computer, a device having a barometer, a heat oxidation-processing device and a thickness-measuring device. The host computer, the barometer, the heat oxidation processing device and the thickness-measuring device are connected via a network so as to transmit data to and from each device.

REFERENCES:
patent: 5798141 (1998-08-01), Harada
patent: 05-032500 (1993-02-01), None
patent: 07-074166 (1995-03-01), None
patent: 8-172084 (1996-07-01), None
patent: 11-186249 (1999-07-01), None
patent: 2002-184705 (2002-06-01), None
Translation of JP 11-186249.
Translation of JP 9-205049.
Translation of JP 05-032500.
Saki K. and S. Kawase, et al. “Novel Approach for Precise Control of Oxide Thickness.” Semiconductor Manufacturing Symposium, 2001 IEEE International (2001): 451-454.

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