Optimally shaped solder joints for improved reliability and spac

Details Optimally shaped solder joints for improved reliability and spac Optimally shaped solder joints for improved reliability and spac

1994-12-23

1997-06-17

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228118, 22818021, H05K 334

Patent

active

056390130

ABSTRACT:
A method for improving the reliability of solder joints is disclosed for use in reflow soldering. In the method, a predetermined amount of solder is applied to at least two solder pads on a circuit board and a component having at least two terminals is fixed in relation to the solder pads. The solder is melted so that the component floats to a predetermined height above the solder pads and, when solidified, the solder fillet formed at each terminal holds the component a predetermined height above the circuit board and forms a convex shape.

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