Optimal cut for saw devices on langasite

Details Optimal cut for saw devices on langasite Optimal cut for saw devices on langasite

1997-06-06

1999-06-29

Ramirez, Nestor

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

H01L 4108

Patent

active

059172657

ABSTRACT:
A lanthanum gallium silicate single crystal substrate, referred to as langasite, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital transducer (IDT) of the SAW device, a surface acoustic wave is generated in the langasite piezoelectric substrate. The surface acoustic wave propagates in a direction generally perpendicular to electrodes of the IDT. The langasite crystal cut and wave propagation directions are defined which reduce insertion loss due to SAW transduction, diffraction, and beam steering. As a result, temperature stability for the SAW device is improved. A low power flow angle and reduced level of diffraction is also achieved.

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