Patent
1991-04-04
1992-09-29
Carroll, J.
357 74, 357 75, 357 80, 357 84, H01L 2940, H01L 2302, H01L 2316, H01L 2504
Patent
active
051517698
ABSTRACT:
The invention relates to the provision of an RF shield for an individual or a collection of integrated circuit chips in a module containing a plurality of hybrid interconnected chips generating interfering RF fields that would interfere with operation of that chip if unshielded. The chips in the module may function in the analog and/or digital mode. The RF shield comprises separate metallizations under and over the chip, the two metallizations being interconnected by a line of discrete electrically conductive vias forming cage-like sides to complete an electrically conductive enclosure about the chip. The vias are spaced closely enough to prevent the escape or entry of RF waves at the frequencies of interest. The RF shield is advantageously fabricated using metallizations and vias that are optically patterned by the same process steps used to effect hybrid interconnection of the chips.
REFERENCES:
patent: 4739389 (1988-04-01), Goedbloed
patent: 4907061 (1990-03-01), Kohara
patent: 4942450 (1990-07-01), Iwashita
patent: 4958222 (1990-09-01), Takakura et al.
patent: 5050238 (1991-09-01), Tomizuka et al.
Chase Robert F.
Immorlica, Jr. Anthony A.
Carroll J.
Checkovich Paul
General Electric Company
Young Stephen A.
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