Optically-guiding multichip module

Optical waveguides – Optical fiber bundle – Fiber bundle plate

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385 14, 385115, G02B 604

Patent

active

058482148

ABSTRACT:
A Fiber Optic Plate is the substrate or part of the substrate in a multichip module. Multichip modules can be stacked to form layers of densely packed integrated circuit die. Optical signals carry data from one layer in the stack to one or more of the other multichip module layers or to peripheral devices physically separate from the stack. Data are transmitted at much greater speed by such optical signals than by traditional electronic interconnects. The Fiber Optic Plate guides the optical signals, minimizing signal crosstalk and allowing for many optical signals to occupy a small area on the module. A Fiber Optic Plate as all or part of the multichip module also provides a means to accurately align the individual modules in a stack.

REFERENCES:
patent: 5335361 (1994-08-01), Ghaem
patent: 5638469 (1997-06-01), Feldman et al.

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