Optically coupled integrated circuit array

Details Optically coupled integrated circuit array Optically coupled integrated circuit array

1982-08-19

1985-08-06

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Signal isolator

357 19, G02B 2700

Patent

active

045338337

ABSTRACT:
Two-dimensional semiconductor chips are stacked to form a three-dimensional array in which coupling between chips is effected optically. This permits the use of smaller chips, with a corresponding higher yield, and serves to reduce the chip area required for interconnecting leads. It also reduces the internal interconnection path lengths which, at present, limit the speed of operation.

REFERENCES:
patent: 3480780 (1969-11-01), List et al.
patent: 3493760 (1970-02-01), Hoadley
patent: 3562527 (1971-02-01), Chaimowicz
patent: 3748548 (1973-07-01), Haisty et al.
patent: 3962655 (1976-06-01), Selway et al.
patent: 4384368 (1983-05-01), Rosenfeldt et al.
Inst. Phys. Conf. Ser. No. 63, Chapter 11, Symp. GaAs and Related Compounds, Japan 1981, pp. 515-520, "Materials and Processes for GaAs Integrated Circuits", by F. H. Eisen.

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