Optical waveguide module with reinforcing member and buffer prot

Details Optical waveguide module with reinforcing member and buffer prot Optical waveguide module with reinforcing member and buffer prot

1997-09-25

1999-12-07

Lee, John D.

Optical waveguides

With optical coupler

Particular coupling structure

385 51, 385 99, G02B 630

Patent

active

059996749

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to an optical waveguide module which encapsulates an optical waveguide device utilized for branching, coupling, or the like of signal light in an optical transmission system. More particularly, the invention concerns the package structure of the optical waveguide module applicable to fiber-optic communication systems requiring high reliability.


BACKGROUND ART

The conventional optical waveguide modules are arranged to comprise an optical waveguide device, which is utilized for branching, coupling, or the like of signal light, for optically interconnecting optical fibers being transmission lines, and a case for enclosing the optical waveguide device therein. Further, a space between the case and the optical waveguide device is filled with a buffer protector. The buffer protector functions to absorb impact or the like exerted from the outside of the case on joint portions and the like between an optical waveguide incorporated in the optical waveguide device and optical fibers.
Here, the above optical waveguide device comprises a waveguide substrate having an optical waveguide provided in its upper surface and having the function of branching, coupling, etc. of signal light, a silicon V-grooved support member (first support member) for optically connecting one end of the optical waveguide with one end of an input optical fiber, attached to the tip of the input optical fiber, and a silicon V-grooved support member (second support member) for optically connecting the other end of the optical waveguide with one end of an output optical fiber, attached to the tip of the output optical fiber. The first and second support members are fixed to the both end faces of the waveguide substrate with the optical waveguide being axially aligned with the input and output optical fibers (or in an optically interconnected state).
The structure of optical waveguide module as described above is disclosed, for example, in Japanese Laid-open Patent Application No. 5-27139.


DISCLOSURE OF INVENTION

The present invention concerns the package structure of the optical waveguide module applicable to fiber-optic communication systems requiring high reliability. The inventors investigated the conventional optical waveguide module as described above and found that the conventional optical waveguide module cannot sufficiently prevent occurrence of expansion and contraction of the case with change of ambient temperature.
Namely, the input optical fiber and output optical fiber are subject to tensile stress under high-temperature environment or subject to shear stress under low-temperature environment, depending upon their setting environment. This results in deteriorating adhesive strength of an adhesive bonding the V-grooved support member to the waveguide substrate with a lapse of time, which will increase optical losses due to axial shift at the joint surfaces between these members. Further, if deterioration of adhesive strength of the adhesive is great, the V-grooved support member can be peeled off from the waveguide substrate.
A conceivable countermeasure is to change the material for the case to glass or liquid crystal polymer with a low coefficient of linear thermal expansion, but in this case, glass has such a strength property that it is weak against impact, while the liquid crystal polymer has such a processing property that it is not easy to make a thin case thereof. Therefore, they cannot achieve downsizing of the case as a result.
It is also conceivable to preliminarily give the input optical fiber and output optical fiber a marginal length and encapsulate them in a curved state inside the case. However, the encapsulating work of these optical fibers requires too much labor and time, which is not suitable for mass production.
It is, therefore, an object of the present invention to provide an optical waveguide module excellent in environmental resistance characteristics and high in reliability, which can reduce the number of components of a package for housing the optical waveg

REFERENCES:
patent: 5367591 (1994-11-01), Seike et al.
patent: 5426714 (1995-06-01), Gadkaree et al.
patent: 5444804 (1995-08-01), Yui et al.
patent: 5481632 (1996-01-01), Hirai et al.
patent: 5513290 (1996-04-01), Ishikawa et al.
patent: 5625730 (1997-04-01), Ishikawa et al.
patent: 5696860 (1997-12-01), Semura et al.

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