Optical waveguide-integrated substrate, method for producing...

Optical waveguides – Planar optical waveguide

Reexamination Certificate

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Reexamination Certificate

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06859601

ABSTRACT:
An optical waveguide-integrated substrate includes a first optical waveguide on part of one side (referred to as the first side) of a substrate and a second optical waveguide on part of the other side (referred to as the second side) of the substrate. Both optical waveguides include a core and a cladding layer enclosing the core. A method for producing an optical waveguide-integrated substrate inpludes preparing a substrate, forming a first optical waveguide on part of the first side of the substrate, and forming a second optical waveguide on part of the second side of the substrate at a temperature different from that for forming the first optical waveguide. An optical transceiver includes the optical waveguide-integrated substrate, at least one optical-signal-transmitting device mounted on the remaining part of the first side of the substrate, and at least one optical-signal-receiving device mounted on the remaining part of the second side of the substrate.

REFERENCES:
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patent: 5859941 (1999-01-01), Horita et al.
patent: 6320992 (2001-11-01), Goldner et al.
patent: 6411765 (2002-06-01), Ono
patent: 6549708 (2003-04-01), Worchesky et al.
patent: 8-110431 (1996-04-01), None
patent: 11-68705 (1999-03-01), None
Takahashi, et al., “Packaging of optical semicondutor chips for SFF optical transceiver”, “Proceedings of the 1999 Electronics Society Conference of IEICE (The Institute of Electronics, Information and Communication Engineers of Japan),” vol. 1, No. C-3-28, p. 133 and English translation thereof.
Tatemi Ido, “Polymer PLC Transceiver Module” Central Research Lab, Hitachi Ltd. (Mar. 2001) and English translation.

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