Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-03-15
2011-03-15
Sandvik, Benjamin P (Department: 2826)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257S099000, C257SE33067
Reexamination Certificate
active
07906355
ABSTRACT:
An optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, an optical waveguide device produced by the method, and an optical waveguide connection structure to be used for the optical waveguide device. The optical waveguide device includes a light emitting element (21) mounted on an upper surface of a board (20), and a core layer (29) which seals the light emitting element (21). The core layer (29) has an optical waveguide insertion recess (25) and an optical coupling lens (27) unitarily formed in a portion thereof opposed to a light emitting surface of the light emitting element (21). One end of an optical waveguide (30) is inserted in the recess (25) and fixed by a sealing resin (31). Thus, the optical waveguide (30) is optically coupled with a light emitting/receiving point of the light emitting element (21) in the core layer (29).
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Nitto Denko Corporation
Sandvik Benjamin P
Westerman Hattori Daniels & Adrian LLP
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