Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-07-12
2011-07-12
Bolda, Eric (Department: 3663)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S026000, C359S344000
Reexamination Certificate
active
07977127
ABSTRACT:
To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely.An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.
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Kaneko Tarou
Kanemoto Mitsunori
Bolda Eric
NEC Corporation
Sughrue & Mion, PLLC
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