Optical transceiver module having a dual segment molded lead...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S516000, C439S736000, C385S092000, C385S093000, C385S089000

Reexamination Certificate

active

07144259

ABSTRACT:
An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

REFERENCES:
patent: 4471158 (1984-09-01), Roberts
patent: 4689023 (1987-08-01), Strong et al.
patent: 5295214 (1994-03-01), Card et al.
patent: 5632630 (1997-05-01), Card et al.
patent: 6086413 (2000-07-01), Karasik et al.
patent: 6488534 (2002-12-01), Soga et al.
patent: 6527571 (2003-03-01), Muta et al.
patent: 6652294 (2003-11-01), Zhang
patent: 6688897 (2004-02-01), Korsunsky et al.
patent: 6764336 (2004-07-01), Ma et al.
patent: 6764338 (2004-07-01), Fang
patent: 6796852 (2004-09-01), Okamoto
patent: 6817782 (2004-11-01), Togami et al.
patent: 6922231 (2005-07-01), Wang et al.
patent: 6966800 (2005-11-01), Mott
patent: 2003/0026081 (2003-02-01), Liu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Optical transceiver module having a dual segment molded lead... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical transceiver module having a dual segment molded lead..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical transceiver module having a dual segment molded lead... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3659902

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.