Optical sub-assembly packaging techniques that incorporate...

Details Optical sub-assembly packaging techniques that incorporate... Optical sub-assembly packaging techniques that incorporate...

2005-03-08

2005-03-08

Nguyen, Chau N. (Department: 2831)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S094000

Reexamination Certificate

active

06863450

ABSTRACT:
Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

REFERENCES:
patent: 4927228 (1990-05-01), Van De Pas
patent: 6497518 (2002-12-01), Deane
patent: 20030026556 (2003-02-01), Mazotti et al.
patent: 20030113074 (2003-06-01), Kohlstadt et al.
patent: 20040047570 (2004-03-01), Lo et al.

Affiliated with

Also associated with

Rating

Optical sub-assembly packaging techniques that incorporate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical sub-assembly packaging techniques that incorporate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical sub-assembly packaging techniques that incorporate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3406045