Optical sub-assembly for optoelectronic modules

Details Optical sub-assembly for optoelectronic modules Optical sub-assembly for optoelectronic modules

2005-07-12

2005-07-12

Lee, John R. (Department: 2881)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S049000, C385S089000, C385S090000, C385S092000

Reexamination Certificate

active

06916121

ABSTRACT:
Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

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