Optical sensor package and method of making same

Details Optical sensor package and method of making same Optical sensor package and method of making same

1998-08-21

2000-10-10

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Charge transfer device

257215, 257291, 257434, 257692, H01L 27148

Patent

active

061304484

ABSTRACT:
A package that encapsulates an integrated circuit optical sensor and mounts on a support substrate includes a base substrate constructed of an insulating material. The optical sensor bottom surface is bonded to the base substrate top surface. Conductive strips on the base substrate top surface extend from a region near the optical sensor to an edge of the base substrate top surface. Wires are bonded on one end to a sensor bonding pad for which connection is desired and on the other end to a corresponding conductive strip. A window is bonded to the base substrate top surface in a spaced-apart relationship using seal material extending around the sensor enclosing each wire bond. Various means are provided for connecting each conductive strip to a corresponding trace on the support substrate. An electrochromic variable attenuator may be formed on the window, allowing control over the intensity of light striking the optical sensor.

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