Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2005-10-25
2005-10-25
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C257S673000, C257S749000
Reexamination Certificate
active
06958261
ABSTRACT:
An image sensor device includes a QFN type leadframe having a central die attach flag and an outer bonding pad area having a plurality of bonding pads. A sensor IC is attached to the flag. The IC has a first surface with an active area and a peripheral bonding pad area that includes bonding pads. Wires are wirebonded to respective ones of the IC bonding pads and corresponding ones of the leadframe bonding pads, thereby electrically connecting the IC and the leadframe. Stud bumps are formed on the first surface of the IC and a transparent cover is disposed over the IC active area and resting on the stud bumps. The cover allows light to pass therethrough onto the IC active area. A mold compound is formed over the leadframe, wirebonds and a peripheral portion of the cover.
REFERENCES:
patent: 4957882 (1990-09-01), Shinomiya
patent: 5264393 (1993-11-01), Tamura et al.
patent: 6121675 (2000-09-01), Fukamura et al.
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6384472 (2002-05-01), Huang
patent: 6492699 (2002-12-01), Glenn et al.
patent: 6661083 (2003-12-01), Lee et al.
patent: 6759642 (2004-07-01), Hoshino
patent: 59040566 (1984-03-01), None
patent: 61207062 (1986-09-01), None
patent: 62069674 (1987-03-01), None
patent: WO 01/15237 (2001-03-01), None
PCT International Search Report.
Amkor Technology, Inc. “Data Sheet VisionPak™ LCC,” [Online] Available http://amkor.com, Apr. 2001.
Shellcase, “Wafer Level Chip Size Packaging,” [Online] Available http://www.shellcase.com/pages/products.asp, Sep. 20, 2002.
Cheng Man Hon
Chow Wai Wong
Ho Wai Keung
Baumeister B. William
Farahani Dana
Freescale Semiconductor Inc.
LandOfFree
Optical sensor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical sensor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical sensor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3454046