Optical sensor chip package

Details Optical sensor chip package Optical sensor chip package

2005-09-14

2008-07-29

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S778000

Reexamination Certificate

active

07405456

ABSTRACT:
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

REFERENCES:
patent: 5867368 (1999-02-01), Glenn
patent: 6774481 (2004-08-01), Ono
patent: 6984866 (2006-01-01), Mostafazadeh et al.
patent: 7030471 (2006-04-01), Perillat

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