Optical semiconductor package and process for fabricating...

Details Optical semiconductor package and process for fabricating... Optical semiconductor package and process for fabricating...

2005-05-17

2005-05-17

Reichard, Dean A. (Department: 2831)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S093000, C385S094000, C385S073000, C257S433000, C257S099000

Reexamination Certificate

active

06893169

ABSTRACT:
A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.

REFERENCES:
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5973337 (1999-10-01), Knapp et al.
patent: 6143588 (2000-11-01), Glenn

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