Optical semiconductor module and method of producing the same

Semiconductor device manufacturing: process – Including control responsive to sensed condition

Reexamination Certificate

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Details

C438S007000, C438S006000, C438S122000, C385S094000, C385S088000, C385S092000, C257S712000

Reexamination Certificate

active

06855566

ABSTRACT:
An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package11includes two or more units of electronic cooling element16mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts14aof ceramic feedthrough of the package11and a bottom plate13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package11occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

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