Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
2006-10-10
2006-10-10
Healy, Brian (Department: 2883)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S014000, C385S088000, C385S092000, C438S029000, C438S031000
Reexamination Certificate
active
07118294
ABSTRACT:
An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
REFERENCES:
patent: 6517259 (2003-02-01), Murata
patent: 2000-206376 (2000-07-01), None
patent: 2001-59924 (2001-03-01), None
patent: 2002-250846 (2002-09-01), None
Furuyama Hideto
Hamasaki Hiroshi
Imoto Takashi
Numata Hideo
Dupuis Derek L.
Healy Brian
Kabushiki Kaisha Toshiba
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
Optical semiconductor module and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical semiconductor module and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical semiconductor module and its manufacturing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3713958