Optical semiconductor housing with transparent chip and...

Details Optical semiconductor housing with transparent chip and... Optical semiconductor housing with transparent chip and...

2007-05-08

2007-05-08

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S777000, C257S686000

Reexamination Certificate

active

10482017

ABSTRACT:
Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component (6), a rear face of which is attached to a front face of a mounting and electrical connection support (2) and a front face of which comprises an optical sensor (9), means (11) for electrically connecting the semiconductor component to the support, a transparent chip (12) placed in front of the semiconductor component, which lies at least in front of the optical sensor, and encapsulation means (21) comprising an encapsulation material which envelopes, in front of the support, the periphery of the semiconductor component and of the chip, without covering at least the central part of the front face of this chip.

REFERENCES:
patent: 5261013 (1993-11-01), Murata et al.
patent: 5835142 (1998-11-01), Nakamura et al.
patent: 6396116 (2002-05-01), Kelly et al.
patent: 6519044 (2003-02-01), Holzapfel et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 407111235 (1995-04-01), None

Affiliated with

Also associated with

Rating

Optical semiconductor housing with transparent chip and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical semiconductor housing with transparent chip and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical semiconductor housing with transparent chip and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3740110