Optical semiconductor device package and optical...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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C257S099000

Reexamination Certificate

active

11260403

ABSTRACT:
An optical semiconductor device package includes a disc-shaped stem, metallic leads in rod form penetrating the stem in the direction of the thickness to protrude from a main surface of the stem, and a mount extending vertically from the main surface of the stem, with a plane part of the mount facing the leads. A dielectric substrate is mounted on the plane part, and an optical semiconductor chip is mounted thereon. Two impedance-adjusting dielectric substrates which are rectangular in plan view are provided extending in parallel with the leads, to cover the plane part facing the leads.

REFERENCES:
patent: 6587491 (2003-07-01), Yamamoto
patent: 2005/0047460 (2005-03-01), Go et al.
patent: 2005/0047732 (2005-03-01), Kato et al.
patent: 2005/0100293 (2005-05-01), Warashina et al.
patent: 2005/0111503 (2005-05-01), Ishigami et al.
patent: 2004-311923 (2004-11-01), None

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