Optical semiconductor device, electronic device, and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S095000, C257S098000, C257S100000

Reexamination Certificate

active

11368457

ABSTRACT:
A resin molded portion5is provided with a first protruding molded portion17that protrudes from a first inclination portion11and a second protruding molded portion18that protrudes from a second inclination portion12.The first protruding molded portion17and the second protruding molded portion18are diced along dicing lines DL in the same manner as a wiring substrate1so that a first protruding portion17band a second protruding portion18bare formed on the first inclination portion11and the second inclination portion12,respectively. The first protruding portion17band the second protruding portion18bhave flat portions17sand18sin the direction perpendicular to the plane surface of the wiring substrate1.

REFERENCES:
patent: 6998647 (2006-02-01), Morimoto et al.
patent: 2002/0094177 (2002-07-01), Horio
patent: 2002/0149119 (2002-10-01), Kumatani
patent: 2002/0154366 (2002-10-01), Horio
patent: 2003/0015718 (2003-01-01), Nakanishi et al.
patent: 11026816 (1999-01-01), None
patent: 11040859 (1999-02-01), None
patent: 11-204555 (1999-07-01), None
patent: 2000114583 (2000-04-01), None
patent: 2005077640 (2005-03-01), None
patent: WO 2005064689 (2005-07-01), None

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