Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2000-10-20
2001-11-20
Bowers, Charles (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S027000, C438S029000, C438S069000, C257S098000
Reexamination Certificate
active
06319746
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to an optical semiconductor device for optical communications, and, more particularly to, the mount structure of an optical semiconductor device, and relates to a method for fabricating the optical semiconductor device.
BACKGROUND OF THE INVENTION
An example of the conventional mount structure of an optical semiconductor device is reported in K. Yamauchi et al., “A Surface Mountable Optical Module for Subscriber Network”, Proceedings of The 1996 IEICE General Conference, Electronics-1, SC-2-7, pp.442-443(1996). In this example, an optical semiconductor element (PD element) and a semiconductor element (preamplifier) are mounted as pair chips so as to provide the minimization and to enhance the function and productivity.
However, in the conventional optical semiconductor device, the substrate to mount the optical semiconductor element is mounted being separated from the semiconductor element substrate to drive the optical semiconductor element. Therefore, a clearance to insert a mounting jig when mounting the substrates is required, thereby increasing the entire size of the optical semiconductor device. Also, the bonding wire to connect between the substrates must be lengthened that much, thereby increasing the wire inductance and thus preventing the device from operating at a higher speed. Further, due to the separated structure, the number of parts must be increased and the productivity must be lowered.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide an optical semiconductor device that is further minimized and has an enhanced operation speed and productivity.
It is a further object of the invention to provide a method for fabricating an optical semiconductor device that is further minimized and has an enhanced operation speed and productivity.
According to the invention, an optical semiconductor device, comprising:
an optical semiconductor element; and
a semiconductor element region provided as a peripheral circuit for the optical semiconductor element;
wherein the optical semiconductor element is mounted on a semiconductor substrate that includes the semiconductor element region.
According to another aspect of the invention, a method for fabricating an optical semiconductor device, comprising the steps of:
depositing metal thin film on a silicon substrate where a semiconductor element region provided as a peripheral circuit for an optical semiconductor element is in advance formed by using a silicon semiconductor process;
further coating it with photoresist film;
conducting its exposure and development to expose the metal thin film at parts where to form a mark for positioning the optical semiconductor element and a V-groove for holding an optical fiber;
removing the exposed metal thin film by etching to expose the silicon substrate;
conducting anisotropic etching to the exposed silicon substrate to form the V-groove for holding the optical fiber; and
mounting the optical semiconductor element on the silicon substrate by using the positioning mark.
REFERENCES:
patent: 4897711 (1990-01-01), Blonder et al.
patent: 4989935 (1991-02-01), Stein
patent: 5412748 (1995-05-01), Furuyama et al.
patent: 5909523 (1999-06-01), Sakaino et al.
patent: 62-13088 (1987-01-01), None
patent: 63-75063 (1988-05-01), None
patent: 1-130112 (1989-05-01), None
patent: 4-102810 (1992-04-01), None
patent: 7-43542 (1995-02-01), None
Japanese Office Action dated Jun. 1, 1999, with partial translation.
K. Yamauchi et al., “A Surface Mountable Optical Module for Subscriber Network”, Proceedings of the 1996 IEICE General Conference, Electronics-1, SC-2-7, pp. 442-443, Mar. 38-31, 1996.
Berezny Nema
Bowers Charles
McGinn & Gibb PLLC
NEC Corporation
LandOfFree
Optical semiconductor device and method for fabricating the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical semiconductor device and method for fabricating the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical semiconductor device and method for fabricating the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2618113