Optical semiconductor device

Details Optical semiconductor device Optical semiconductor device

1989-05-12

1991-01-15

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 23055

Patent

active

049855972

ABSTRACT:
Holes are formed in a major surface of a hybrid IC insulating substrate mounting an optical semiconductor element, and terminal pins of a package are connected and fixed to the substrate while head portions of the terminal pins are inserted in the corresponding holes. Since the terminal pins do not protrude outside the major surface of the insulating substrate, a space therefor can be omitted, and the terminal pins are directly connected to the insulating substrate without being separated from each other. Furthermore, since the head portions of the terminal pins are inserted in the corresponding holes of the insulating substrate, they can be automatically aligned. In case that each hole has a tapered inner surface, insertion of the terminal pins can be further facilitated.

REFERENCES:
patent: 3482198 (1969-12-01), Hopper, Jr.
IBM Technical Disclosure Bulletin, vol. 29, No. 4, Sep. 1986, p. 1637, "Selective Etchant for Tin-Lead Composition Determination".
Patent Abstracts of Japan, vol. 10, No. 1, (E-371)(2058), 1/7/86, Fujitsu K.K.

Affiliated with

Also associated with

Rating

Optical semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-56547