Optical semiconductor bare chip, printed wiring board,...

Details Optical semiconductor bare chip, printed wiring board,... Optical semiconductor bare chip, printed wiring board,...

2007-07-10

2007-07-10

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S088000, C257S432000, C257S692000, C257S778000, C257SE23007

Reexamination Certificate

active

10543636

ABSTRACT:
A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board2, a distance D between wiring patterns81and85disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip14disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges83and87of the wiring patterns81and85recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges148and149of the LED chip14.

REFERENCES:
patent: 6164836 (2000-12-01), Yamada et al.
patent: 0 921 577 (1997-12-01), None
patent: 55-16415 (1980-02-01), None
patent: 2001-015817 (2001-01-01), None
patent: 2001-230448 (2001-08-01), None
patent: 2002-094123 (2002-03-01), None

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