Optical semiconductor assembly having a conductive float pad

Details Optical semiconductor assembly having a conductive float pad Optical semiconductor assembly having a conductive float pad

1997-01-27

1998-09-29

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257432, 257678, 257 99, 438 16, H01L 310232, H01L 310203, H01L 3300

Patent

active

058148710

ABSTRACT:
An optical semiconductor assembly including a metal stem, a hermetic glass substrate fixed to the stem, and a conductive float pad formed on the hermetic glass substrate. The first to third leads are mounted to the stem so as to be insulated from the stem and pass through the stem. An optical semiconductor element is mounted on a lead head of the third lead, and a bare chip IC is mounted on the stem. By using the float pad, screening of the optical semiconductor element is performed during assembly. After completing the assembly, the characteristics of the assembly are checked to thereby perform screening of the bare chip IC. Thus, two independent steps of screening are performed, so that improvement in yield of the completed products can be expected.

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patent: 5550675 (1996-08-01), Komatsu
patent: 5610395 (1997-03-01), Nishiyama

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