Optical scanner capable of flip-chip hermetic packaging

Details Optical scanner capable of flip-chip hermetic packaging Optical scanner capable of flip-chip hermetic packaging

2006-12-12

2006-12-12

Cherry, Euncha P. (Department: 2872)

Optical: systems and elements

Deflection using a moving element

By moving a reflective element

C359S291000, C359S212100

Reexamination Certificate

active

07149023

ABSTRACT:
Provided is an optical scanner capable of hermetic sealing with a round of flip-chip bonding. The optical scanner includes an upper substrate and a lower substrate, a mirror suspended between the upper substrate and the lower substrate to seesaw, a plurality of movable comb electrodes vertically formed at predetermined intervals at both sides of the mirror, a plurality of upper static comb electrodes and lower static comb electrodes respectively vertically installed on the upper substrate and the lower substrate to alternate with the plurality of movable comb electrodes, a plurality of electrode structures respectively transmitting external voltage to the upper and lower static comb electrodes and the movable comb electrodes, and an upper outer frame and a lower outer frame respectively formed along edges of the upper and lower substrates and bonded to each other to seal the mirror from the outside.

REFERENCES:
patent: 5945599 (1999-08-01), Fujiyoshi et al.
patent: 6731420 (2004-05-01), Orcutt et al.
patent: 2002/0149864 (2002-10-01), Kaneko
patent: 2004/0100679 (2004-05-01), Kuo

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