Optical proximity correction halftone type phase shift photomask

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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G06F 900

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058276238

ABSTRACT:
In a halftone type phase shift photomask, a patterned halftone layer is formed on a transparent substrate, and a light screen layer is formed on the halftone layer. A part of a mask pattern is changed from opaque to halftone, thus improving the resist pattern fidelity.

REFERENCES:
patent: 5429896 (1995-07-01), Hashida et al.
K. Hashimoto et al.; "The Application of Deep UV Phase Shifted-Single Layer Halftone Reticles to 256 Mbit Dynamic Random Access Memory Cell Patterns"; Jpn. J. Appl. Phys., vol. 33, (1994) pp. 6823-6830.
R. Pforr et al.; "Feature biasing versus feature-assisted lithography--a comparison of proximity correction methods for 0.5*(.lambda./NA) lithography"; SPIE, vol. 2440, pp. 150-170.
J. Garofalo et al.; "Reduction of ASIC Gate-level line-end shortening by Mask Compensation"; SPIE, vol. 2440, pp. 171-183.
O. Otto et al., "Integrating proximity effects corrections with photomask data preparation"; SPIE, vol. 2440, pp. 184-191.
J. Garofalo et al.; Automated Layout of Mask Assist-features for Realizing 0.5k.sub.1 ASIC Lithography; SPIE, vol. 2440, pp. 302-2440.
W. Han et al.; "Optical proximity correction using a Transmittance Controlled Mask (TCM)"; SPIE, vol. 2440, pp. 494-505.
T. Yasuzato et al.; "Improvement of resist pattern fidelity with partial attenuated phase shift mask"; Paper 2726-53, SPIE's 1996 International Symposium on Microlithography, Mar. 10-15, 1996, Santa Clara, CA.; p. 255.

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