Optical processing apparatus

Details Optical processing apparatus Optical processing apparatus

2004-05-11

2008-09-02

Kerns, Kevin P (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S223000, C228S104000, C228S103000, C219S121780

Reexamination Certificate

active

07419085

ABSTRACT:
The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

REFERENCES:
patent: 4671446 (1987-06-01), Sherman
patent: 5148375 (1992-09-01), Horikami
patent: 6696668 (2004-02-01), Hayakawa
patent: 2002/0090014 (2002-07-01), Ishimaru
patent: 2004/0226979 (2004-11-01), Sato et al.
patent: 06169167 (1994-06-01), None
patent: P2002-1521 (2002-01-01), None
Hayakawa Jun, Method and Device for Laser Beam Soldering, Aug. 2002, JPO and NCIPI, English Translation of JP-2002-001521.

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