Optical polishing apparatus and methods

Details Optical polishing apparatus and methods Optical polishing apparatus and methods

1997-12-05

1999-05-04

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451287, 451 41, B24B 4900, B24B 5100

Patent

active

058997920

ABSTRACT:
Optical polishing methods and apparatus are disclosed for polishing and planarizing surfaces of a wafer or other workpiece. A polishing apparatus according to the present invention preferably comprises a dispenser for dispensing polishing agent between a polishing body and the surface of the object to be polished. The polishing apparatus moves the polishing body and the object being polished against one another. The polishing body preferably comprises a light-permeable substance. A film-thickness measuring device for measuring the thickness of a film on the object being polished is preferably positioned on the side of the polishing body opposite of the surface of the object being polished. The film-thickness measuring device preferably measures the film thickness by using a light source to irradiate the object being polished through the polishing body. The film-thickness measuring device then uses light reflected from the film of the object being polished to determine the film's thickness.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5667424 (1997-09-01), Pan
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5823853 (1998-10-01), Bartels et al.

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