Optical pickup device

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

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C228S214000, C228S102000

Reexamination Certificate

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06997370

ABSTRACT:
A method for assembling an optical disk apparatus involves disposing first and second short-cutting terminals at different faces of a housing and in parallel with a laser diode of the apparatus. In a first state of assembling, the first short-cutting terminal is shorted by a solder applied thereon. Thereafter, the apparatus is inspected in a second state of assembling in which the solder is removed from the first short-cutting terminal. After inspection, the second short-cutting terminal is shorted by a solder applied thereon. Subsequently, the solder on the second short-cutting terminal is removed.

REFERENCES:
patent: 3532967 (1970-10-01), Milton et al.
patent: 4683422 (1987-07-01), Goodson
patent: 5917795 (1999-06-01), Furukawa et al.
patent: 6243346 (2001-06-01), Furukawa et al.
patent: 5-335689 (1993-12-01), None
patent: 9-231598 (1997-09-01), None
Takekoshi, Taro, Translation to JP 5-335689, Dec. 1993, 4 pages.

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