Optical package substrate, optical device, optical module,...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S052000

Reexamination Certificate

active

06904190

ABSTRACT:
Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.

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