Optical package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0505664

CLAIM:
The ornamental design for a optical package, as shown and described.

REFERENCES:
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Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glass.4.htm, “Glass-to-Metal Seals”, 2 pages, 2001-2002.
Patent Abstracts of Japan, JP 10-284640, Oct. 23, 1998.
Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996.
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Patent Abstracts of Japan, JP 05-129461, May 25, 1993.
Patent Abstracts of Japan, JP-07-176649, Jul. 14, 1995.

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