Optical module package and method for manufacturing the same

Details Optical module package and method for manufacturing the same Optical module package and method for manufacturing the same

1999-02-10

2000-09-26

Palmer, Phan T. H.

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

385 88, 385 94, G02B 636

Patent

active

061234648

ABSTRACT:
A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.

REFERENCES:
patent: 5430820 (1995-07-01), Van Tongeren et al.
patent: 5513198 (1996-04-01), Jakobson
patent: 5661835 (1997-08-01), Kato et al.
patent: 5770473 (1998-06-01), Hall et al.
patent: 5812716 (1998-09-01), Ohishi
patent: 6056447 (2000-05-01), Caras

Affiliated with

Also associated with

Rating

Optical module package and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical module package and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical module package and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2094556