Optical module & method for manufacturing the same

Optical waveguides – With optical coupler – Particular coupling structure

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385 51, 385 88, 228165, 228193, G02B 630

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active

057939144

ABSTRACT:
An optical module and method in which an optical element (32) and an optical waveguide (34) are formed on a silicon substrate (31) so that an optical axis of the optical element coincides with an optical axis of the optical waveguide. Metallized films (41, 42) are formed on the silicon substrate and on the optical waveguide respectively, and these metallized films are bonded to each other by mutual diffusion of their atoms.

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patent: 5475784 (1995-12-01), Bookbinder et al.
patent: 5555333 (1996-09-01), Kato
Michael J. Wale et al., "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec. 1990, pp. 780-786.

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