Optical module having lenses aligned on lens-positioning V-groov

Details Optical module having lenses aligned on lens-positioning V-groov Optical module having lenses aligned on lens-positioning V-groov

1997-04-25

1998-12-29

Palmer, Phan T. H.

Optical waveguides

With optical coupler

Particular coupling structure

385 88, 385 93, G02B 630

Patent

active

058548670

ABSTRACT:
An improved optical module having lenses aligned on a lens-positioning V-groove and a fabrication method thereof which includes a silicon substrate, which defines a light transfer path below a surface thereof, including light transferring V-grooves and a light receiving V-groove, and lens-positioning V-groove for determining the position of a lens, wherein two lens-positioning V-grooves are formed therein, an optical transmitter module including a laser which is a light source and is flip-chip-bonded to the substrate by a solder bump after an optical waveguide is previously aligned with the V-groove by using an alignment mark behind the vertical portion of the light transferring v-groove. A light transferring lens attached on one lens-positioning V-groove for condensing the light from the laser, and a laser monitoring optical detector arranged on a side wall opposite the laser of the light transferring V-groove, wherein an active region is flip-chip-bonded toward the substrate, for monitoring the laser, and an optical receiver module including a light receiving lens attached on the lens-positioning V-groove of the silicon substrate for condensing beam externally transferred thereto, and a light receiving optical detector attached to the light receiving lens for detecting beam externally transferred thereto, wherein the optical transmitter module and the optical receiver module are arranged in the same silicon substrate.

REFERENCES:
Nakasuga, Y., et al. Multi-chip hybrid integration on PLC platform using passive alignment technique, 1996 Electronics Components and Technology Conference, pp. 20-25.
Jackson, K. P., et al. A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology, Journal of Lightwave Technology, vol. 12, No. 7, Jul. 1994, pp. 1185-1191.
Schmidt, J. P., et al. Laser-fiber-coupling by means of silicon micro-optical bench and a self-aligned soldering process, SPIE, vol. 2449, pp. 176-183.
Yoshida, J., et al. A compact optical module with a 1.3-.mu.m/1.5.mu.m WDM circut for fiber optic subscriber systems, IEICE Trans. Commun., vol. E75-B, No. 9, Sep. 9, 1992, pp. 880-885.

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